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Thermal modeling and management in ultrathin chip stack technology
Pinel, Stèphane; Marty, Antoine; Tasselli, Josiane; Bailbe, Jean-Pierre; Beyne, Eric; Van Hoof, Rita; Marco Colás, Santiago; Morante i Lleonart, Joan Ramon; Vendier, Olivier; Huan, Marc
Universitat de Barcelona
2010-05-04
Anàlisi tèrmica
Administració
Finite element analysis
Thermal conductivity
Thermal management (packaging)
(c) IEEE, 2002
Article
IEEE
         

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