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Residual thermomechanical stresses in thinned-chip assemblies
Leseduarte Cuevas, Sergio; Marco Colás, Santiago; Beyne, Eric; Van Hoof, Rita; Marty, Antoine; Pinel, Stèphane; Vendier, Olivier; Coello-Vera, Augustín
Universitat de Barcelona
2010-05-04
Delamination
Finite element analysis
Integrated circuit design
Integrated circuit interconnections
Integrated circuit packaging
Thermal stresses
Circuits integrals
(c) IEEE, 2000
Article
IEEE
         

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Pinel, Stèphane; Marty, Antoine; Tasselli, Josiane; Bailbe, Jean-Pierre; Beyne, Eric; Van Hoof, Rita; Marco Colás, Santiago; Morante i Lleonart, Joan Ramon; Vendier, Olivier; Huan, Marc
 

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