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A time-domain method for the analysis of thermal impedance response preserving the convolution form
Carmona Flores, Manuel; Marco Colás, Santiago; Palacín Roca, Jordi; Samitier i Martí, Josep
Universitat de Barcelona
2010-05-04
Circuits integrats
Convolucions (Matemàtica)
Mètodes iteratius (Matemàtica)
Convolution
Finite element analysis
Integrated circuit packaging
Iterative methods
Multichip modules
Thermal model
Thermal resistance
Time-domain analysis
(c) IEEE, 1999
Article
IEEE
         

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