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dc.contributor	Universitat de Barcelona
dc.contributor.author	Costa, J. M.
dc.contributor.author	Sagués i Mestre, Francesc
dc.contributor.author	Vilarrasa, M.
dc.date	2009-10-06T08:31:46Z
dc.date	2009-10-06T08:31:46Z
dc.date	1991
dc.date.accessioned	2010-05-04T14:16:17Z
dc.date.available	2010-05-04T14:16:17Z
dc.date.issued	2010-05-04T14:16:17Z
dc.identifier.citation	1050-2947
dc.identifier.uri	http://hdl.handle.net/2445/9522
dc.format	4 p.
dc.format	application/pdf
dc.language.iso	eng
dc.publisher	The American Physical Society
dc.relation	Reproducció digital del document publicat en format paper, proporcionada per PROLA i http://dx.doi.org/10.1103/PhysRevA.43.7057
dc.relation	Physical Review A, 1991, vol. 43, núm. 12, p. 7057-7060.
dc.rights	(c) The American Physical Society, 1991
dc.rights	info:eu-repo/semantics/openAccess
dc.subject	Electroquímica
dc.subject	Deposició (Metal·lúrgia)
dc.subject	Electrochemistry
dc.subject	Plating
dc.title	Growth rate of fractal copper electrodeposits: Potential and concentration effects
dc.type	info:eu-repo/semantics/article
dc.description.abstract	Experiments are reported on fractal copper electrodeposits. An electrochemical cell was designed in order to obtain a potentiostatic control on the quasi-two-dimensional electrodeposition process. The aim was focused on the analysis of the growth rate of the electrodeposited phase, in particular its dependence on the electrode potential and electrolyte concentration.